ERSA equips ZESTRON's Technical Center

with "Best in Class" HOTFLOW 3/20 Reflow oven

Plymouth, WI. - June 8, 2009 ZESTRON America was selected and took delivery of the ERSA HOTFLOW 3/20 - "Best in Class" Reflow Oven Designed for Maximum Throughput". This 10 Zone Reflow Oven has a process length of over 16 feet and has been designed for maximum throughput.

The completely re-engineered HOTFLOW 3/20 reflow oven has been designed to deliver the "Best in Class" results for all areas that ultimately affect the bottom line profit per PCB. The days of investing in just any reflow oven that has the number desired of heating zones required are over. Today, the economical aspects and true performance of the oven must play a major role in the decision making process.

"The HOTFLOW 3/20 will provide ZESTRON the capability of using "best in class" equipment to perform reflow. Subsequent cleaning trials will confirm the effectiveness of our cleaning agents in compliance with IPC Standard 610A as well as other applicable standards" said Dr. Harald Wack, President of ZESTRON worldwide. He added that the HOTFLOW 3/20 installation was successfully completed by ERSA's technical support team.

ZESTRON, with over 33 years of high precision cleaning experience, is the leading supplier of precision cleaning products and services for PCB defluxing, as well as a variety of other applications including stencil and equipment maintenance cleaning.

Since their introduction into the market nearly 30 years ago, ERSA reflow ovens have been setting the industry standard for high-end reflow machines. The new HOTFLOW is the third generation machine based on the proven & proprietary ERSA Multijet heating technology. The R&D of this HOTFLOW series had its focus on improved heat transfer via a complete re-design of the process tunnel, improved throughput via a revolutionary multitrack transport, reduced energy and N2 consumption, improved cooling, as well as optimized process control.